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Creators/Authors contains: "Kim, Min-gu"

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  1. ; ; (, Nature Communications)
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  2. ; ; (, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII))
    This paper presents a novel fabrication technique to create submicrometer-scale liquid metal (eutectic gallium-indium alloy, EGaIn) thin-film patterns for all-soft electronic devices. The proposed hybrid lithography process combines electron-beam lithography with soft lithography and enables high resolution and high density all-soft electronic passive components and microelectrode arrays. For the first time, submicrometer-scale EGaIn thin film patterning with feature sizes as small as 375 nm is demonstrated. Thanks to the intrinsic softness of EGaIn, the fabricated devices can endure mechanical strain >30%, while maintaining electrical functionality. 
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